The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2010

Filed:

Apr. 10, 2008
Applicants:

Kazuhito Hatta, Fukushima, JP;

Masato Sato, Fukushima, JP;

Hiroyuki Yamada, Fukushima, JP;

Takehiko Suwa, Fukushima, JP;

Toshio Koishikawa, Fukushima, JP;

Inventors:

Kazuhito Hatta, Fukushima, JP;

Masato Sato, Fukushima, JP;

Hiroyuki Yamada, Fukushima, JP;

Takehiko Suwa, Fukushima, JP;

Toshio Koishikawa, Fukushima, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); H01M 2/30 (2006.01); H01M 10/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A battery pack includes a non-aqueous electrolyte secondary battery, a rigid covering member, and a protection circuit board. The secondary battery includes a battery element and a flexible covering member formed of a first laminated film composed of a first heat-bonding layer, a first metal layer, and a first outer covering layer which are laminated successively. The flexible covering material is sealed along around the battery element while leaving electrode terminals of the positive and negative electrodes extended outside the battery element. The rigid covering member covers the non-aqueous electrolyte secondary battery together with the flexible covering member, and is formed of a second laminated film composed of a second heat-bonding layer, a second metal layer, and a second outer covering layer which are laminated successively. The flexible covering member and the rigid covering member are bonded by melting the second heat-bonding layer without melting the first outer covering layer.


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