The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Nov. 01, 2006
Jae Hoon Choung, Kyoungki-do, KR;
IN Kyung Lee, Kyoungki-do, KR;
Won Young Choi, Seoul, KR;
Tae Young Lee, Kyoungki-do, KR;
Ji Chul Yang, Seoul, KR;
Jae Hoon Choung, Kyoungki-do, KR;
In Kyung Lee, Kyoungki-do, KR;
Won Young Choi, Seoul, KR;
Tae Young Lee, Kyoungki-do, KR;
Ji Chul Yang, Seoul, KR;
Cheil Industries, Inc., , KR;
Abstract
Provided herein are chemical mechanical polishing (CMP) slurries and methods for producing the same. Embodiments of the invention include CMP slurries that include (a) a metal oxide; (b) a quaternary ammonium base; and (c) a fluorinated surfactant. In some embodiments, the fluorinated surfactant is a non-ionic perfluoroalkyl sulfonyl compound. Also provided herein are methods of polishing a polycrystalline silicon surface, including providing a slurry composition according to an embodiment of the invention to a polycrystalline silicon surface and performing a CMP process to polish the polycrystalline silicon surface.