The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Apr. 17, 2008
Applicant:

Yuichi Yoshida, Miyazaki, JP;

Inventor:

Yuichi Yoshida, Miyazaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a semiconductor device which comprises a lead frame including a die pad having one or two or more openings, a substrate mounted over the die pad so as to expose a plurality of semiconductor chip connecting second electrode pads from the openings of the die pad, a plurality of semiconductor chips mounted over the die pad and the substrate, bonding wires that connect chip electrode pads of the semiconductor chip and their corresponding semiconductor chip connecting first and second electrode pads of the substrate, and a sealing portion which covers these and is provided so as to expose parts of leads.


Find Patent Forward Citations

Yoshida, Yuichi. (2010). Lead frame, semiconductor device using same and manufacturing method thereof (U.S. Patent No. 7705469). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7705469

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…