The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Nov. 08, 2006
Robert S. Vinson, Indialantic, FL (US);
Joseph B. Brief, West Melbourne, FL (US);
Donald J. Beck, Palm Bay, FL (US);
Gregory M. Jandzio, Melbourne, FL (US);
Robert S. Vinson, Indialantic, FL (US);
Joseph B. Brief, West Melbourne, FL (US);
Donald J. Beck, Palm Bay, FL (US);
Gregory M. Jandzio, Melbourne, FL (US);
Harris Corporation, Melbourne, FL (US);
Abstract
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.