The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Jan. 17, 2006
Applicants:

Georg Ernst, Thalmassing, DE;

Horst Groeninger, Maxhütte-Haidhof, DE;

Simon Jerebic, Regensburg, DE;

Thomas Zeiler, Regensburg, DE;

Inventors:

Georg Ernst, Thalmassing, DE;

Horst Groeninger, Maxhütte-Haidhof, DE;

Simon Jerebic, Regensburg, DE;

Thomas Zeiler, Regensburg, DE;

Assignee:

Infineon Technologies, AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are wettable with solder material and anti-wetting regions that are unwettable with solder material, and the electronic component includes solder deposits formed on the wetting regions on the underside of the component.


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