The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Aug. 01, 2008
Applicants:

Heribert Weber, Nuertingen, DE;

Ralf Hausner, Reutlingen, DE;

Inventors:

Heribert Weber, Nuertingen, DE;

Ralf Hausner, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

A micromechanical component, in particular a micromechanical sensor, having a first wafer and a second wafer is provided, the first wafer having at least one structural element, and the second wafer having at least one mating structural element, and, in addition, the structural element and the mating structural element are designed in such a way that a relative displacement of the first wafer relative to the second wafer parallel to a main extension plane of the first wafer essentially leads to compressive loading or tensile loading between the structural element and the mating structural element.


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