The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Sep. 08, 2006
Nobuaki Miyamoto, Hitachi, JP;
Akira Chinda, Hitachi, JP;
Koki Hirasawa, Kawasaki, JP;
Kenji Uchida, Kawasaki, JP;
Nobuaki Miyamoto, Hitachi, JP;
Akira Chinda, Hitachi, JP;
Koki Hirasawa, Kawasaki, JP;
Kenji Uchida, Kawasaki, JP;
Hitachi Cable, Ltd., Tokyo, JP;
NEC Electronics Corporation, Kawasaki, Kanagawa, JP;
Abstract
An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.