The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

May. 10, 2005
Applicants:

Jürgen Steiger, Düsseldorf, DE;

Hubert Spreitzer, Viernheim, DE;

Inventors:

Jürgen Steiger, Düsseldorf, DE;

Hubert Spreitzer, Viernheim, DE;

Assignee:

Merck Patent GmbH, Darmstadt, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/40 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 35/24 (2006.01); H01B 1/00 (2006.01); C08K 5/01 (2006.01); C08G 73/12 (2006.01); C09K 11/06 (2006.01); C09D 11/00 (2006.01); B05D 1/06 (2006.01); B05D 1/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

Solutions comprising: (i) at least one organic semiconductor, (ii) at least one organic solvent A having a boiling point, and (iii) at least one organic solvent B having a boiling point; wherein the at least one organic semiconductor comprises at least one high molecular weight component, wherein the at least one organic solvent A is a good solvent for the at least one organic semiconductor, wherein the at least one organic solvent B is a poor solvent for the at least one organic semiconductor; and wherein the boiling point of the at least one solvent A is greater than the boiling point of the at least one solvent B; and the use of such solutions in processes for forming organic semiconductor layers on substrates and devices formed by such processes.


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