The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Mar. 13, 2001
Applicants:

Francis Dell'ova, Fuveau, FR;

Frank Lhermet, La Ciotat, FR;

Dominique Poirot, Auriol, FR;

Stephane Rayon, Avenue de la Marine, FR;

Bertrand Gomez, Roquevaire, FR;

Nicole Lessoile, Auriol, FR;

Pierre Rizzo, Aubagne, FR;

Inventors:

Francis Dell'Ova, Fuveau, FR;

Frank Lhermet, La Ciotat, FR;

Dominique Poirot, Auriol, FR;

Stephane Rayon, Avenue de la Marine, FR;

Bertrand Gomez, Roquevaire, FR;

Nicole Lessoile, Auriol, FR;

Pierre Rizzo, Aubagne, FR;

Assignee:

STMicroelectronics S.A., Montrouge, FR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is provided for manufacturing an integrated electronic component arranged on a substrate wafer. According to the method, at least one metallization step is performed, and a value of an electrical parameter of the integrated electronic component is determined after the at least one metallization step. A subsequent metallization step is performed after determining the value of the electrical parameter. The subsequent metallization step is performed using an adjustment mask chosen from n predefined masks based on a desired value of the electrical parameter, so as to obtain the desired value of the electrical parameter of the integrated electronic component after manufacturing. In one preferred embodiment, a series of electrical tests is performed on the wafer using test equipment, and the value of the electrical parameter is determined using the same test equipment as is used to perform the series of electrical tests.


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