The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Apr. 25, 2007
Tadahiko Kawabe, Kanishi Gifu, JP;
Masao Kuroda, Inuyama, JP;
Yasuhiro Sugimoto, Konan, JP;
Hajime Saiki, Konan, JP;
Shinji Yuri, Kasugai, JP;
Makoto Origuchi, Komaki, JP;
Tadahiko Kawabe, Kanishi Gifu, JP;
Masao Kuroda, Inuyama, JP;
Yasuhiro Sugimoto, Konan, JP;
Hajime Saiki, Konan, JP;
Shinji Yuri, Kasugai, JP;
Makoto Origuchi, Komaki, JP;
NGK Spark Plug Co., Ltd., Aichi-Ken, JP;
Abstract
A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.