The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Apr. 26, 2005
Koji Takayama, Yamagata, JP;
Masatoshi Sato, Yamagata, JP;
Shinichi Hayasaka, Yamagata, JP;
Hiroyuki Kobayashi, Yamagata, JP;
Koji Takayama, Yamagata, JP;
Masatoshi Sato, Yamagata, JP;
Shinichi Hayasaka, Yamagata, JP;
Hiroyuki Kobayashi, Yamagata, JP;
Pioneer Corporation, Tokyo, JP;
Tohoku Pioneer Electronic Corporation, Yamagata, JP;
Abstract
A method for manufacturing a diaphragm for use in an electroacoustic transducer in a multi-layer structure which includes a first diaphragm layer of synthetic resin molded in a predetermined shape by injection molding and a second diaphragm layer layered in intimate contact on the first diaphragm layer and made of substance different from the first diaphragm layer, includes executing successively a pre-molding step and an injection-molding step, thereby providing the multi-layer structure. The pre-molding step includes attaching a non-molded sheet-like material which is a raw material of the second diaphragm layer to a mating surface of one of the die part of an injection molding die, and closing thereafter the injection molding die to give the sheet-like material a predetermined diaphragm shape. The injection molding step includes injecting synthetic resin material constituting the first diaphragm layer into the injection molding die thus closed thereby to form the first diaphragm layer.