The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7704408 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 27, 2010

Filed:

Nov. 22, 2005
Applicant:

Hiroki Fukatsu, Shizuoka, JP;

Inventor:

Hiroki Fukatsu, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 19/38 (2006.01); C08G 63/06 (2006.01); C08L 67/03 (2006.01); G11B 7/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a resin-molded component for signal reader, which is light in weight and is able to improve the vibration damping property and to increase the resonance frequency, and which is excellent in heat dissipation. Specifically, it provides a resin-molded component for signal reader structured by 55 to 75% by weight of liquid crystalline polymer (A) composed of structural units expressed by general formulae (I) through (IV):—O—Ar—CO—  (I)—CO—Ar—CO—  (II)—O—Ar—O—  (III)—O—Ar—CO—  (IV)(where, Aris 2,6-naphthalene group, Aris selected from 1,2-phenylene group, 1,3-phenylene group, and, 1,4-phenylene group, Aris selected from 1,3-phenylene group, 1,4-phenylene group, and p,p'-polyphenylene group, and Aris 1,4-phenylene group); 20 to 10% by weight of inorganic hollow sphere (B1); and 25 to 15% by weight of fibrous inorganic filler (B2), and has 1.4 or smaller specific gravity d, 0.5 W/m·K or larger thermal conductivity λ, and 10 GPa or larger flexural modulus.


Find Patent Forward Citations

Fukatsu, Hiroki. (2010). Resin-molded component for signal reader and method for molding thereof (U.S. Patent No. 7704408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7704408

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