The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Oct. 25, 2005
Applicants:

Stefano Sergio Oggioni, Milan, IT;

Vincenzo Condorelli, Poughkeepsie, NY (US);

Nihad Hadzic, Wappingers Falls, NY (US);

Kevin C. Gotze, Poughkeepsie, NY (US);

Tamas Visegrady, Zurich, CH;

Inventors:

Stefano Sergio Oggioni, Milan, IT;

Vincenzo Condorelli, Poughkeepsie, NY (US);

Nihad Hadzic, Wappingers Falls, NY (US);

Kevin C. Gotze, Poughkeepsie, NY (US);

Tamas Visegrady, Zurich, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for embedding tamper proof layers and discrete components into a printed circuit board stack-up is disclosed. According to this method, a plating mask is applied on a base substrate to cover partially one of its faces. Conductive ink is then spread on this face so as to fill the gap formed by the plating mask. To obtain a uniform distribution of the conductive ink and then gel it, the conductive ink is preferably heated. A dielectric layer is applied on the conductive ink layer and the polymerization process is ended to obtain a strong adhesion between these two layers. In a preferred embodiment, conductive tracks are simultaneously designed on the other face of the base substrate to reduce thermo-mechanical strains and deformations.


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