The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Mar. 05, 2007
Yoshinori Takezawa, Gifu, JP;
Kazuhiro Hasegawa, Gifu, JP;
Takahiro Asano, Gifu, JP;
Takashi Nakata, Gifu, JP;
Yoshinori Takezawa, Gifu, JP;
Kazuhiro Hasegawa, Gifu, JP;
Takahiro Asano, Gifu, JP;
Takashi Nakata, Gifu, JP;
SANYO Electric Co., Ltd., Osaka, JP;
Abstract
A multi-chip package suppresses a change, which is caused by packaging, of a circuit characteristic of an analog circuit of which characteristic is adjusted by a nonvolatile register. A digital circuit and an analog circuit are formed on a semiconductor chip. A nonvolatile register is also formed on the semiconductor chip to store information to adjust a circuit characteristic of the analog circuit. The circuit characteristic of the analog circuit is adjusted according to the information stored in this nonvolatile register. Then, another dummy semiconductor chip is attached with an adhesive being superimposed on a circuit area of the analog circuit to build a multi-chip package.