The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2010

Filed:

Sep. 26, 2005
Applicants:

Reinhold Bayerer, Warstein, DE;

Markus Thoben, Soest, DE;

Inventors:

Reinhold Bayerer, Warstein, DE;

Markus Thoben, Soest, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power semiconductor module () has power semiconductor components () arranged on a substrate (), at least one portion of which components is connected in parallel and arranged symmetrically on the substrate (). A second conduction plane () is provided for making contact with the power semiconductor components (). The second conduction plane is arranged in a manner electrically insulated from the substrate surface () above the surfaces of the power semiconductor components () that are remote from the substrate surface ().


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