The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7700998 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 20, 2010

Filed:

Jun. 30, 2008
Applicants:

Hideki Okumura, Hyogo-ken, JP;

Takayoshi Nogami, Himeji, JP;

Hiroto Misawa, Hyogo-ken, JP;

Inventors:

Hideki Okumura, Hyogo-ken, JP;

Takayoshi Nogami, Himeji, JP;

Hiroto Misawa, Hyogo-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
Abstract

A type semiconductor device includes: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type; a third semiconductor layer of the first conductivity type; a plurality of gate electrodes which are formed in gate trenches via gate insulating films, the gate trenches being formed through the second semiconductor layer and the third semiconductor layer; a plurality of impurity regions of the second conductivity type which are formed at regions below bottoms of contact trenches, the contact trenches being formed at the third semiconductor layer in a thickness direction thereof between corresponding ones of the gate trenches and longitudinal cross sections of the contact trenches being shaped in ellipse, respectively; first electrodes which are formed so as to embed the contact trenches and contacted with the impurity regions, respectively; and a second electrode formed on a rear surface of the semiconductor substrate.


Find Patent Forward Citations

Okumura, Hideki. (2010). Semiconductor device and method for manufacturing the same (U.S. Patent No. 7700998). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7700998

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