The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2010

Filed:

Feb. 17, 2004
Applicants:

Mamoru Takahashi, Sodegaura, JP;

Masahiko Okamoto, Sodegaura, JP;

Tetsuji Kasai, Sodegaura, JP;

Yasushi Tohi, Sodegaura, JP;

Shiro Otsuzuki, Yamaguchi, JP;

Shinichi Nagano, Ichihara, JP;

Yasuo Funabara, Ichihara, JP;

Takahiro Akashi, Ichihara, JP;

Inventors:

Mamoru Takahashi, Sodegaura, JP;

Masahiko Okamoto, Sodegaura, JP;

Tetsuji Kasai, Sodegaura, JP;

Yasushi Tohi, Sodegaura, JP;

Shiro Otsuzuki, Yamaguchi, JP;

Shinichi Nagano, Ichihara, JP;

Yasuo Funabara, Ichihara, JP;

Takahiro Akashi, Ichihara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 10/14 (2006.01); C08F 4/42 (2006.01);
U.S. Cl.
CPC ...
Abstract

An ethylene polymer containing 0.01 to 1.20 mol % of a constitutional unit derived from α-olefin having 6 to 10 carbon atoms, wherein with respect to cross fractionation chromatography (CFC), either (1) the weight average molecular weight (Mw) of the components eluted at 73 to 76° C. does not exceed 4,000, or (2) the ethylene polymer satisfies the following relationship (Eq-1), provides a molded product having excellent moldability and therefore excellent mechanical strength and appearance:≦0.1  (Eq-1)wherein Sis the sum of the total peak areas related to the components eluted at 70 to 85° C., and Sis the sum of the total peak areas related to the components eluted at 0 to 145° C.


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