The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Dec. 07, 2005
Ryuji Kanzaka, Nishikamo-gun, JP;
Hironori Tanikawa, Obu, JP;
Ryuji Kanzaka, Nishikamo-gun, JP;
Hironori Tanikawa, Obu, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Aisan Kogyo Kabushiki Kaisha, Obu-shi, JP;
Abstract
A resin molded component includes a flange having a through-hole. A concave portion is formed on the surface of the flange that faces the component on which the flange is fitted. Flows of a molten resin material meet each other at a meeting portion in a region around the through-hole during a molding process, and a weld line is formed at the meeting portion. The concave portion is formed upstream of the meeting portion at which the flows of the molten resin material meet each other, and in the vicinity of the through-hole. The thickness of the resin material in the bottom portion of the concave portion is greater than the thickness of the resin material in the thinnest portion of the wall of the concave portion.