The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Aug. 12, 2008
Applicant:

Christian A. Witt, Woodbridge, CT (US);

Inventor:

Christian A. Witt, Woodbridge, CT (US);

Assignee:

Advanced Micro Devices, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods for forming copper interconnects for semiconductor devices are provided. In an exemplary embodiment, a method for forming a copper interconnect comprises depositing copper into a trench formed in a dielectric material overlying a semiconductor material. A force is applied to the semiconductor material and stress is induced within the copper deposited in the trench. Recrystallization and grain growth are effected within the copper and the stress is removed.


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