The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Jan. 16, 2007
Applicants:

Wilhelm Stein, Liudau, DE;

Michael Fehrer, Bad Abbach, DE;

Johannes Baur, Laaber, DE;

Matthias Winter, Regensburg, DE;

Andreas Ploessl, Regensburg, DE;

Stephan Kaiser, Regensburg, DE;

Berthold Hahn, Hemau, DE;

Franz Eberhard, Regensburg, DE;

Inventors:

Wilhelm Stein, Liudau, DE;

Michael Fehrer, Bad Abbach, DE;

Johannes Baur, Laaber, DE;

Matthias Winter, Regensburg, DE;

Andreas Ploessl, Regensburg, DE;

Stephan Kaiser, Regensburg, DE;

Berthold Hahn, Hemau, DE;

Franz Eberhard, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for producing an electrical contact of an optoelectronic semiconductor chip (), comprising providing a mirror layer (), comprised of a metal or metal alloy, over the semiconductor chip; providing a protective layer () over said mirror layer; providing a layer sequence of a barrier layer and a coupling layer () over said protective layer; and providing a solder layer () over said layer sequence.


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