The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Mar. 25, 2008
Applicants:

Chien-an Yu, Taipei County, TW;

Te-yin Chen, Taoyuan County, TW;

Hai-han Hung, Taoyuan County, TW;

Inventors:

Chien-An Yu, Taipei County, TW;

Te-Yin Chen, Taoyuan County, TW;

Hai-Han Hung, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabricating a semiconductor device having a recess channel structure is provided. A first recess is formed in a substrate. A liner and a filling layer are formed in the first recess. A portion of the substrate adjacent to the first recess and a portion of the liner and the filling layer are removed to form trenches. An insulation layer fills the trenches to form isolation structures. The filling layer is removed, using the liner as an etching stop layer, to expose the insulation layer. A portion of the exposed insulation layer is removed to form a second recess having divots adjacent to the sidewalls of the substrate. The liner is removed. A dielectric layer and a gate are formed over the substrate covering the second recess. Source and drain regions are formed in the substrate adjacent to the second recess.


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