The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Jul. 25, 2007
Patty Pei-ling Chang-chien, Redondo Beach, CA (US);
Chi Kong Cheung, Pasadena, CA (US);
Melanie Sachiko Yajima, Los Angeles, CA (US);
Xianglin Zeng, Monterey Park, CA (US);
Patty Pei-Ling Chang-Chien, Redondo Beach, CA (US);
Chi Kong Cheung, Pasadena, CA (US);
Melanie Sachiko Yajima, Los Angeles, CA (US);
Xianglin Zeng, Monterey Park, CA (US);
Northrop Grumman Systems Corporation, Los Angeles, CA (US);
Abstract
A method for mounting a dielectric substrate to a semiconductor substrate, such as mounting a dielectric antenna substrate to an MMIC semiconductor substrate. The method includes providing a thin dielectric antenna substrate having metallized layers on opposing sides. In one embodiment, carrier wafers are used to handle and maintain the dielectric substrate in a flat configuration as the metallized layers are patterned. The dielectric substrate is sealed to the semiconductor substrate using a low temperature bonding process. In an alternate embodiment, the metallized layers on the dielectric substrate are patterned simultaneously so as to prevent the substrate from curling.