The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Feb. 23, 2009
Katsumi Kikuchi, Tokyo, JP;
Tadanori Shimoto, Tokyo, JP;
Koji Matsui, Tokyo, JP;
Kazuhiro Baba, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Tadanori Shimoto, Tokyo, JP;
Koji Matsui, Tokyo, JP;
Kazuhiro Baba, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.