The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Sep. 21, 2005
Applicants:

Yasuo Matsumura, Kanagawa, JP;

Hirotaka Matsuoka, Kanagawa, JP;

Satoshi Hiraoka, Kanagawa, JP;

Yuki Sasaki, Kanagawa, JP;

Fumiaki Mera, Kanagawa, JP;

Hideo Maehata, Kanagawa, JP;

Inventors:

Yasuo Matsumura, Kanagawa, JP;

Hirotaka Matsuoka, Kanagawa, JP;

Satoshi Hiraoka, Kanagawa, JP;

Yuki Sasaki, Kanagawa, JP;

Fumiaki Mera, Kanagawa, JP;

Hideo Maehata, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 9/087 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for producing a resin particle liquid dispersion for an electrostatic image developing toner, the process comprising: polycondensing a polycondensable monomer by utilizing an acid having a surface activating effect as a polycondensation catalyst, so as to obtain a polycondensed resin; and dispersing the polycondensed resin in an aqueous medium to which a base is added, so as to obtain a resin particle liquid dispersion in which a median diameter of resin particles is from 0.05 to 2.0 μm, or the process comprising: polycondensing a polycondensable monomer by utilizing an acid having a surface activating effect as a polycondensation catalyst in a co-presence of a polycondensed resin, so as to obtain a polycondensed resin-containing material; and dispersing the polycondensed resin-containing material in an aqueous medium, so as to obtain a resin particle liquid dispersion in which a median diameter of resin particles is from 0.05 to 2.0 μm.


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