The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Mar. 06, 2008
Applicants:

Jong-hyeok Park, Daejeon, KR;

Sang-young Lee, Daejeon, KR;

Jang-hyuk Hong, Daejeon, KR;

Moon-ja Nam, Daejeon, KR;

Jung-a Yoo, Daejeon, KR;

Sang-seop Kim, Seoul, KR;

Chang-hun Han, Daejeon, KR;

Inventors:

Jong-Hyeok Park, Daejeon, KR;

Sang-Young Lee, Daejeon, KR;

Jang-Hyuk Hong, Daejeon, KR;

Moon-Ja Nam, Daejeon, KR;

Jung-A Yoo, Daejeon, KR;

Sang-Seop Kim, Seoul, KR;

Chang-Hun Han, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 2/16 (2006.01); H01M 2/18 (2006.01); H01M 10/04 (2006.01); H01M 4/48 (2006.01); B05D 5/12 (2006.01); B05C 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An organic/inorganic composite separator includes a porous substrate having a plurality of pores; and a porous coating layer formed on at least one surface of the porous substrate with a plurality of inorganic particles and a binder polymer. The binder polymer is a copolymer including: (a) a first monomer unit having a contact angle to a water drop in the range from 0° to 49°; and (b) a second monomer unit having a contact angle to a water drop in the range from 50° to 130°. This organic/inorganic composite separator has excellent thermal stability, so it may restrain an electric short circuit between a cathode and an anode. In addition, the separator may prevent inorganic particles in the porous coating layer from being extracted during an assembling process of an electrochemical device, thereby improving stability of an electrochemical device.


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