The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Jan. 25, 2006
Applicants:

Maarten Oosterbroek, Westervoort, NL;

Jan Dijkema, Zutphen, NL;

Edze Jan Visscher, Utrecht, NL;

Inventors:

Maarten Oosterbroek, Westervoort, NL;

Jan Dijkema, Zutphen, NL;

Edze Jan Visscher, Utrecht, NL;

Assignee:

Colbond B.V., Arnhem, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D05C 15/00 (2006.01); D05C 15/04 (2006.01); D05C 17/02 (2006.01); D04H 3/08 (2006.01); D04H 3/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A tufted nonwoven includes a face material which tufts a bonded nonwoven having a mixture of a plurality of bicomponent filaments 1 with a plurality of bicomponent filaments 2. At least bicomponent filaments 1 have component 11 and component 12. Component 11 exhibits a melting temperature T(11), and component 22 of the bicomponent filaments 2 exhibits a melting temperature T(22). Component 12 exhibits a melting temperature T(12), and component 21 of the second bicomponent filaments exhibits a melting temperature T(21), and T(12) is higher than T(21). The melting temperatures of components 11 and 22 and the melting temperatures of components 12 and 21 obey a relationship in which T(11) and T(22)>T(12)>first T(21) and optionally wherein the face material is bonded to bicomponent filaments 2 by a solidified melt of component 21. Also described are a bonded nonwoven and methods for their manufacture.


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