The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Feb. 21, 2006
Haruhiko Takahashi, Tokyo, JP;
Ryuta Kurihara, Tokyo, JP;
Haruhiko Takahashi, Tokyo, JP;
Ryuta Kurihara, Tokyo, JP;
Zeon Corporation, Tokyo, JP;
Abstract
Provided are a method for producing molded articles of cured resin without deterioration of transferability and mold removability, as well as molded articles of cured resin obtained by the method. A method for producing molded articles of cured resin, including: (i) molding a first molded article of cured resin using a resin mold for the curable resin, the resin mold having been prepared by molding a resin composition containing an alicyclic structure-containing polymer and a hindered phenol compound, (ii) after use in the molding, heat-treating the resin mold for the curable resin, at a temperature lower by 5 to 60° C. than the glass transition temperature of the resin composition for a period of time in a range of 30 seconds to 100 hours, and (iii) molding a second molded article of the cured resin using the heat-treated resin mold for the curable resin.