The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Jul. 21, 2004
David A. Stark, Dallas, TX (US);
Laurence D. Schultz, Richardson, TX (US);
Neal T. Murphy, Richardson, TX (US);
David A. Stark, Dallas, TX (US);
Laurence D. Schultz, Richardson, TX (US);
Neal T. Murphy, Richardson, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
The present invention provides a system () for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (). The system provides a first slurry component (), and a second slurry component (). A conditioning component () has first and second inlets, and an outlet operatively coupled to a dispensing system (). First and second flow control components () are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source (), adapted to generate an energy field () across the conditioning component. A conveyance component () conducts the slurry components from the inlets through the energy field, and delivers a final mixture () of multi-component slurry to the outlet.