The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
May. 17, 2006
Kazuhiko Honjo, Gifu, JP;
Toshihiko Mori, Osaka, JP;
Eiji Kawamoto, Osaka, JP;
Junichi Kimura, Aichi, JP;
Motoyoshi Kitagawa, Gifu, JP;
Kazuhiko Honjo, Gifu, JP;
Toshihiko Mori, Osaka, JP;
Eiji Kawamoto, Osaka, JP;
Junichi Kimura, Aichi, JP;
Motoyoshi Kitagawa, Gifu, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.