The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Nov. 07, 2006
Steven M. Freedman, Raleigh, NC (US);
Laurie J. Blackburn, Raleigh, NC (US);
Michael J. Wands, Apex, NC (US);
Huyen L. Nguyen, Raleigh, NC (US);
Robert J. Tomasko, Cary, NC (US);
Robert K. Bubnis, Raleigh, NC (US);
Andrew A. Joslin, Morrisville, NC (US);
John A. Crosson, Raleigh, NC (US);
Steven M. Freedman, Raleigh, NC (US);
Laurie J. Blackburn, Raleigh, NC (US);
Michael J. Wands, Apex, NC (US);
Huyen L. Nguyen, Raleigh, NC (US);
Robert J. Tomasko, Cary, NC (US);
Robert K. Bubnis, Raleigh, NC (US);
Andrew A. Joslin, Morrisville, NC (US);
John A. Crosson, Raleigh, NC (US);
Tekelec, Morrisville, NC (US);
Abstract
Systems, methods, and computer program products for providing a distributed hardware platform interface (HPI) architecture are disclosed. According to one aspect, the subject matter described herein includes a system for providing distributed operations, administration, and maintenance (OAM) functionality in a multi-shelf processing environment. The system includes a first shelf that includes first hardware components, a second shelf that includes second hardware components, and an OAM module for providing an OAM function. The system also includes a first hardware platform interface (HPI) daemon for communicating OAM-related information between the first hardware components and the OAM module, and a second HPI daemon for communicating OAM-related information between the second hardware components and the OAM module.