The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Jun. 16, 2006
Benjamin N. Eldridge, Danville, CA (US);
Roy J. Henson, Pleasanton, CA (US);
Eric D. Hobbs, Livermore, CA (US);
Peter B. Mathews, Los Altos, CA (US);
Makarand S. Shinde, Livermore, CA (US);
Benjamin N. Eldridge, Danville, CA (US);
Roy J. Henson, Pleasanton, CA (US);
Eric D. Hobbs, Livermore, CA (US);
Peter B. Mathews, Los Altos, CA (US);
Makarand S. Shinde, Livermore, CA (US);
FormFactor, Inc., Livermore, CA (US);
Abstract
A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.