The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Mar. 22, 2005
Naotaka Tanaka, Chiyoda, JP;
Kenya Kawano, Chiyoda, JP;
Akira Nagai, Tsukuba, JP;
Koji Tasaki, Tsukuba, JP;
Masaaki Yasuda, Tsukuba, JP;
Naotaka Tanaka, Chiyoda, JP;
Kenya Kawano, Chiyoda, JP;
Akira Nagai, Tsukuba, JP;
Koji Tasaki, Tsukuba, JP;
Masaaki Yasuda, Tsukuba, JP;
Abstract
A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea<Eb<Ec, preferably ⅓Eb<Ea<Eb<3Ea(<Ec). With this arrangement, a stable connection state can be attained irrespective of the level of the contact bonding load or fluctuations of it upon mass production and, therefore, high yield can be attained at low cost.