The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7692292 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 06, 2010

Filed:

Dec. 02, 2004
Applicants:

Kazushi Higashi, Osaka, JP;

Shinji Ishitani, Hyogo, JP;

Inventors:

Kazushi Higashi, Osaka, JP;

Shinji Ishitani, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first container member () mounting an electronic device () thereon and a second container member () are bonded with an adhesive () or a metal layer (). Thus an inner space () is formed and the electronic device can be closed in the inner space at a low temperature. In the case the adhesive is used, an exposed surface of the adhesive is coated with a metal film () to improve the closeness of the inner space. Further, an electronic device () may be mounted on the second container member so as to increase the electronic device arrangement density in a packaged electronic device.


Find Patent Forward Citations

Higashi, Kazushi. (2010). Packaged electronic element and method of producing electronic element package (U.S. Patent No. 7692292). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7692292

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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