The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Nov. 17, 2004
Applicants:
Hajime Saiki, Aichi, JP;
Mikiya Sakurai, Kani, JP;
Inventors:
Hajime Saiki, Aichi, JP;
Mikiya Sakurai, Kani, JP;
Assignee:
NGK Spark Plug Co., Ltd., Aichi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring substrate includes a lower insulating resin layer; wiring pattern layers provided on surfaces of the lower insulating resin layer; upper insulating resin layers; and via holes and via conductors connected electrically with at least one of the wiring pattern layers. An upper insulating resin layer includes an epoxy resin containing 30 to 50% by weight of an inorganic filler of SiOhaving an average grain diameter of 1.0 to 10.0 μm, and a via having a lower end opening diameter of between 40 μm and 60 μm.