The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Oct. 14, 2008
Hiroyuki Yano, Uji, JP;
Junji Sugiyama, Uji, JP;
Masaya Nogi, Kyoto, JP;
Shin-ichiro Iwamoto, Uji, JP;
Keishin Handa, Yokohama, JP;
Akira Nagai, Hitachi, JP;
Takao Miwa, Hitachi, JP;
Yoshitaka Takezawa, Hitachi, JP;
Toshiyuki Miyadera, Tsurugashima, JP;
Takashi Kurihara, Musashino, JP;
Tohru Matsuura, Musashino, JP;
Nobutatsu Koshoubu, Musashino, JP;
Tohru Maruno, Musashino, JP;
Hiroyuki Yano, Uji, JP;
Junji Sugiyama, Uji, JP;
Masaya Nogi, Kyoto, JP;
Shin-ichiro Iwamoto, Uji, JP;
Keishin Handa, Yokohama, JP;
Akira Nagai, Hitachi, JP;
Takao Miwa, Hitachi, JP;
Yoshitaka Takezawa, Hitachi, JP;
Toshiyuki Miyadera, Tsurugashima, JP;
Takashi Kurihara, Musashino, JP;
Tohru Matsuura, Musashino, JP;
Nobutatsu Koshoubu, Musashino, JP;
Tohru Maruno, Musashino, JP;
Rohm Co., Ltd., Kyoto-shi, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Pioneer Corporation, Tokyo, JP;
Abstract
The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.