The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Nov. 01, 2005
Haruhiko AE, Ichihara, JP;
Yasumasa Shibata, Ichihara, JP;
Takayoshi Tanaka, Ichihara, JP;
Idemitsu Kosan Co., Ltd., Tokyo, JP;
Abstract
In an injection compression molding method, dies are clamped with low pressure and a melted thermoplastic resin composition is filled in a cavity space from a gate while moving the cavity space relative to the gate, and then the dies are clamped with a high pressure substantially simultaneously with completion of the filling to compress and form the thermoplastic resin composition filled in the cavity space. Since the thermoplastic resin composition containing a high content of thermally-conductive filler such as an electrically-conductive filler can be injected and compressed to be molded, the injection compression molding method can be applied in manufacturing molding such as a fuel cell separator and a flat antenna.