The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2010

Filed:

Feb. 27, 2006
Applicants:

Toshinobu Tokita, Yokohama, JP;

Hirohisa Ota, Kawagoe, JP;

Eigo Kawakami, Utsunomiya, JP;

Kazuyuki Kasumi, Utsunomiya, JP;

Takashi Nakamura, Edogawa-ku, JP;

Inventors:

Toshinobu Tokita, Yokohama, JP;

Hirohisa Ota, Kawagoe, JP;

Eigo Kawakami, Utsunomiya, JP;

Kazuyuki Kasumi, Utsunomiya, JP;

Takashi Nakamura, Edogawa-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/44 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

One object of the present invention is to provide a pattern transferring mold which can provide a starting area of mold release easily and certainly and a pattern transferring apparatus with the same. A pattern transferring mold is disclosed which is used in a pattern transferring apparatus that brings the mold into contact with a photo-curing resin on a substrate and cures the photo-curing resin by light irradiation to transfer a pattern formed on the mold onto the photo-curing resin. The mold comprises a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area. The mold has a mold-releasing shape in the second area, the mold-releasing shape providing a starting area of mold release from the cured photo-curing resin.


Find Patent Forward Citations

Loading…