The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2010

Filed:

May. 01, 2003
Applicant:

Yatsuharu Yokota, Hachioji, JP;

Inventor:

Yatsuharu Yokota, Hachioji, JP;

Assignee:

Yokota Technica Limited Company, Hachioji-shi, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a reflow soldering apparatus comprising a conveyorto transport circuit boardsmounted with electronic components into multiple chambersand, and fansinstalled in the chambersand, the centers of the impellers in the adjacent fansare not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.


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Yokota, Yatsuharu. (2010). Reflow soldering apparatus (U.S. Patent No. 7690550). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7690550

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