The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2010

Filed:

Aug. 31, 2007
Applicants:

Bishnu Prasanna Gogoi, Scottsdale, AZ (US);

Navid Yazdi, Ann Arbor, MI (US);

Inventors:

Bishnu Prasanna Gogoi, Scottsdale, AZ (US);

Navid Yazdi, Ann Arbor, MI (US);

Assignee:

Evigia Systems, Inc., Ann Arbor, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A three-axis inertial sensor and a process for its fabrication using an silicon-on-oxide (SOI) wafer as a starting material. The SOI wafer has a first conductive layer separated from a second conductive layer by an insulative buried oxide (BOX) layer. The SOI wafer is fabricated to partially define in its first conductive layer at least portions of proof masses for z, x, and y-axis sensing devices of the sensor. After a conductive deposited layer is deposited and patterned to form a suspension spring for the proof mass of the z-axis sensing device, the SOI wafer is bonded to a substrate that preferably carries interface circuitry for the z, x, and y-axis devices, with the SOI wafer being oriented so that its first conductive layer faces the substrate. Portions of the BOX layer are then etched to fully release the proof masses.


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