The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Oct. 23, 2007
Pyong-ii Cho, Gyeonggi-do, KR;
Hyun-sik Sim, Gyeonggi-do, KR;
Kyoung-hwan Choi, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor equipment control system and method is provided. The semiconductor equipment control system preferably includes semiconductor equipment having a process recipe stored therein and a host connected to the semiconductor equipment through a network. The host preferably includes a database in which a reference recipe is stored and is preferably configured to receive and compare a final modification time of the process recipe with a final modification time of the reference recipe. When the final modifications times are equal, the host is preferably configured to instruct the semiconductor equipment to perform a process according to the process recipe. When the final modification times are different, the host is preferably configured to check a recipe body of the process recipe against a recipe body of the reference recipe to determine if the process recipe is within an established tolerance. If the process recipe is within tolerance, the host may instruct the semiconductor equipment to perform the process according to the process recipe. If the process recipe is not within tolerance, the host preferably interlocks the process. Using this semiconductor equipment and control method, unconditional checking of the process recipe body can be eliminated, thereby resulting in significant time savings and a more efficient manufacturing process.