The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Mar. 06, 2008
Sadato Imai, Hachioji, JP;
Satoru Kikuchi, Hachioji, JP;
Koichi Fukasawa, Kofu, JP;
Citizen Electronics Co., Ltd., Yamanashi, JP;
Abstract
The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved. In addition, the cost of the electronic-component-mounting board can be reduced.