The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Jul. 06, 2006
Toshiro Izuchi, Fukuoka, JP;
Kazuo Ono, Fukuoka, JP;
Kensuke Nakanishi, Fukuoka, JP;
Hiroaki Onishi, Fukuoka, JP;
Toshiro Izuchi, Fukuoka, JP;
Kazuo Ono, Fukuoka, JP;
Kensuke Nakanishi, Fukuoka, JP;
Hiroaki Onishi, Fukuoka, JP;
Hosiden Corporation, Osaka, JP;
Abstract
To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.