The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2010

Filed:

Feb. 16, 2006
Applicants:

Takeshi Fujitani, Neyagawa, JP;

Masahiro Yoshida, Neyagawa, JP;

Inventors:

Takeshi Fujitani, Neyagawa, JP;

Masahiro Yoshida, Neyagawa, JP;

Assignee:

Onkyo Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/20 (2006.01); D06P 3/24 (2006.01); C08J 5/00 (2006.01); C09J 4/00 (2006.01); C09K 3/00 (2006.01); A47B 81/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The speaker member includes: a base material; and a resin film layer laminated on the base material through an adhesive layer. The adhesive layer has a heat shrinkage ratio of 0.5 to 1.0%; the resin film layer has a heat shrinkage ratio of 0.8 to 1.3%; and the heat shrinkage ratio of the adhesive layer is smaller than the heat shrinkage ratio of the resin film layer. The method of manufacturing a speaker comprises the steps of: applying a predetermined resin composition on a release material; drying the resin composition, so as to form a resin film layer on the release material; applying a predetermined adhesive on the resin film layer, so as to form an adhesive layer; attaching together the resin film layer formed on the release material and a base material through the adhesive layer, so as to form a laminate; subjecting the laminate to aging; and molding the laminate subjected to aging by using a metal mold having a predetermined shape.


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