The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Dec. 08, 2008
Shuichi Takeuchi, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Yoshiyuki Satoh, Kawasaki, JP;
Tetsuya Takahashi, Kawasaki, JP;
Shuichi Takeuchi, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Yoshiyuki Satoh, Kawasaki, JP;
Tetsuya Takahashi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An electronic apparatus manufacturing method comprises applying a first adhesive agent to a mounting portion, a first heating, in such a way that connection pads and bumps, come into contact, by pressing a heating head against a non-mounting surface of the electronic component, heating the electronic component, hardening the first adhesive agent, affixing the mounting substrate and electronic component, filling a space between the mounting substrate and the electronic component with a second adhesive agent under reduced pressure, and a second heating step of, from being under reduced pressure to being under atmospheric pressure, by pressing the heating head against the non-mounting surface of the electronic component, heating the electronic component, as well as hardening the second adhesive agent, melting the connection pads, and joining the connection pads and the bumps.