The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Jun. 23, 2005
Applicant:
Makoto Terui, Yamanashi, JP;
Inventor:
Makoto Terui, Yamanashi, JP;
Assignee:
Oki Semiconductor Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device of a wafer level chip size package type is formed by cutting a semiconductor wafer with a plurality of semiconductor elements formed thereon in pieces. The semiconductor device includes a semiconductor substrate as the semiconductor wafer having a magnetic layer formed on at least one of a front surface and a backside surface of the semiconductor wafer.
Terui, Makoto. (2010). Method of producing a semiconductor device having a magnetic layer formed thereon (U.S. Patent No. 7687283). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7687283
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile