The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2010

Filed:

Jun. 30, 2004
Applicant:

Mirko Lehmann, Freiburg i. Br., DE;

Inventor:

Mirko Lehmann, Freiburg i. Br., DE;

Assignee:

Micronas GmbH, Freiburg i.Br., DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method for structuring the surface of a substrate, a substrate is elastically expanded by the application of a tensile stress so that a surface area of the substrate in which a structure is to be created, is enlarged. Then, in the surface area, a structure is produced that is larger than the structure to be produced. For this purpose at least one solution is applied to the substrate, which solvent contains at least one solid substance dissolved in a solvent. The solvent is then removed from the surface of the substrate so that the solid substance remains behind. The expansion of the substrate is at least partly reversed by the reduction or removal of the tensile stress so that the size of the structure is reduced to the size of the structure to be produced. In the material of the substrate, a compression stress can also be created to reduce the size of the structure to the size of the structure to be produced.


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