The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Dec. 22, 2006
Seiya Sato, Yamagata, JP;
Kyoichi Matsuda, Yamagata, JP;
Seiya Sato, Yamagata, JP;
Kyoichi Matsuda, Yamagata, JP;
Pioneer Corporation, Tokyo, JP;
Tohoku Pioneer Corporation, Yamagata, JP;
Abstract
It is an object of the present invention to improve a speaker edge member manufacturing method in which a substrate is introduced into an edge member molding material by virtue of insertion molding, to prevent a trouble such as a crack on a parting line or the like, thus shortening a manufacturing time and thus reducing a manufacturing cost. The method comprises the steps of: attaching the substrate into the edge member molding die; introducing the edge member formation material into the edge member molding die before or after attaching the substrate into the edge member molding die; heating/pressurizing the substrate and the edge member formation material in the edge member molding die so as to obtain a molded edge member. At this time, the outer edge portion of the substrate is located in a position separated a predetermined distance from the dividing line of the die.