The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2010

Filed:

Aug. 27, 2004
Applicants:

Tadatomo Suga, Nakano-ku, Tokyo 164-0003, JP;

Taehyun Kim, Pyungtaek-si, KR;

Tomoyuki Abe, Himeji, JP;

Inventors:

Tadatomo Suga, Nakano-ku, Tokyo 164-0003, JP;

Taehyun Kim, Pyungtaek-si, KR;

Tomoyuki Abe, Himeji, JP;

Assignees:

Other;

Ayumi Industry Co., Ltd., Hyogo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.


Find Patent Forward Citations

Suga, Tadatomo. (2010). Method for bonding substrates and method for irradiating particle beam to be utilized therefor (U.S. Patent No. 7686912). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7686912

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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