The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2010

Filed:

Dec. 18, 2008
Applicants:

Eugenijus Norkus, Vilnius, LT;

Jane Jaciauskiene, Vilnius, LT;

Yezdi Dordi, Palo Alto, CA (US);

Inventors:

Eugenijus Norkus, Vilnius, LT;

Jane Jaciauskiene, Vilnius, LT;

Yezdi Dordi, Palo Alto, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.


Find Patent Forward Citations

Norkus, Eugenijus. (2010). Electroless deposition from non-aqueous solutions (U.S. Patent No. 7686875). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7686875

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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