The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Dec. 06, 2007
Masayoshi Takeuchi, Fukushima-ken, JP;
Masayoshi Takeuchi, Fukushima-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
The invention provides an electronic circuit module capable of reliably mounting a chip to a multi-layer wiring plate in a flip chip manner. In an electronic circuit module according to an embodiment of the invention, a chip including bumps with a height of d is mounted to a multi-layer wiring plate including surface electrodes and internal electrodes in a flip chip manner. In the multi-layer wiring plate, when the minimum thickness of the surface electrode and the internal electrodes overlapping each other below each of the bumps is TD and the maximum thickness of the surface electrode and the internal electrodes overlapping each other in a space surrounded by the bumps is TI, the surface electrodes and the internal electrodes are arranged so as to satisfy TI<TD+d.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile